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Initiation of Countervailing Duty Investigation:
On Thursday, November 21, the Department of Commerce ("DOC") announced the initiation of a countervailing duty ("CVD") investigation on imports of Dynamic Random Access Memory Semiconductors from South Korea.
Petitioners: The petition requesting this investigation was filed on November 1 by Micron Technology, Inc. (located in Idaho).
Import Statistics: In 2000, imports of DRAMs, DRAM Memory Modules, and DRAM wafers totaled $2.2 billion. In 2001, imports totaled $2.0 billion.
Product Description: The products covered by this investigation are Dynamic Random Access Memory devices from Korea, whether assembled or unassembled. Assembled DRAMs include all package types. Unassembled DRAMs include processed wafers, uncut die, and cut die. Processed wafers fabricated in Korea, but assembled into finished semiconductors outside Korea are included in the scope. Processed wafers fabricated outside Korea and assembled into finished semiconductors in Korea are not included in the scope.
The scope of this investigation also includes memory modules containing DRAMs from Korea. A memory module is a collection of DRAMs, the sole function of which is memory. Memory modules include single in-line processing modules (SIPs), single in-line memory modules (SIMMs), dual in-line memory modules ("DIMMs"), small outline dual in-line memory modules ("SODIMMs"), Rambus in-line memory modules ("RIMMs"), and memory cards or other collections of DRAMs, whether unmounted or mounted on a circuit board. Modules that contain other parts that are needed to support the function of memory are covered. Only those modules that contain additional items which alter the function of the module to something other than memory, such as video graphics adapter ("VGA") boards and cards, are not included in the scope. This investigation also covers future DRAM module types.
The scope of this investigation includes, but is not limited to, video random access memory ("VRAM"), and synchronous graphics RAM ("SGRAM"), as well as various types of DRAMs, including fast page-mode ("FPM"), extended data-out ("EDO"), burst extended data-out ("BEDO"), synchronous dynamic RAM ("SDRAM"), ARambus DRAM (ARDRAM@) and Double Data Rate DRAM, ("DDR SDRAM"). The scope of this investigation also includes any future density, packaging, or assembling of DRAMs. Also included in the scope of this investigation are removable memory modules placed on motherboards, with or without a central processing unit ("CPU"), unless the importer of the motherboards certifies with the Customs Service that neither it, nor a party related to it or under contract to it, will remove the modules from the motherboards after importation. The scope of this investigation does not include DRAMs or memory modules that are re-imported for repair or replacement.
**These deadlines may be extended under the governing statute.
***This will take place only in the event of a final affirmative determination from the DOC and the ITC .
DRAM Memory Modules
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